MODEL- TWIN3X2048-1800C7DFIN   VENDOR- CORSAIR
    
FEATURES- 2GB Kit (2 x 1GB) Dominator DDR3 Memory
       PC3-14400, 7-7-7-20, 240-pin DIMM
       The TWIN3X2048-1800C7DFIN G is a 2048MByte kit of DDR3 SDRAM DIMMs 
        based upon Corsair's ultra performance DOMINATOR family of memory 
        which includes Intel's Extreme Memory Profiles (XMP). XMP is a 
        JEDEC based performance specification for DDR3 memory SPD 
        optimizations developed by Intel and its performance memory module 
        partners. This enables a robust, profile based high performance 
        DDR3 over-clocking solution for Intel platforms targeted for 
        enthusiasts, gamers and overclockers who want to extract maximum
        performance from their platforms.
       Built using Corsair's Dual-path Heat Xchange (DHX) technology 
        coupled with a Corsair Airflow Fan, this part delivers outstanding 
        performance with the Intel's Extreme Series of DDR3-based 
        motherboards and has been tested extensively to ensure 
        compatibility and performance at its rated speed. This memory has 
        been verified to operate at 1800MHz at latencies of 7-7-7-20 at 
        2.0V VDIMM.
* DOMINATOR - Best of Corsair's Engineering 
   Very few components make it into the DOMINATOR family. Corsair performs 
   rigorous testing and screening on all components to select only the best 
   for the DOMINATOR modules. The tests check for high frequency and/or low 
   latency capabilities for each IC. Then, they are thoroughly tested for 
   maximum interoperability and reliability as a united group to meet the 
   stringent design criteria demanded by performance computing and gaming 
   users. 
* Superior Heat Dissipation
   Heat is the enemy of your computer's key components. And the more you 
   tweak components for performance, the more heat is generated. Heat will 
   slow down your system and impact long term reliability. With traditional 
   DDR2 memory, the standard method of chip packaging involves a BGA (Ball 
   Grid Array). In a BGA, small balls of solder, organized as a grid, are 
   the leads that connect the device to the module circuit board. A Micron 
   Semiconductor study shows that in a BGA memory device as much as 50% of 
   the heat generated by the chip is actually conducted into the circuit 
   board. Since traditional heat sinks are only attached to the front 
   surface of memory chips, there's no easy thermal path for the heat 
   coming from the back of the chips. 
* Corsair's Unique Dual-path Heat Xchange (DHX) Solves the Problem 
   Corsair's engineers have developed a unique technology that maximizes 
   heat dissipation while improving reliability, even in the most extremely 
   overclocked memory module. Dual-Path Heat Exchange (DHX) technology 
   utilizes two methods to effectively remove heat from the memory circuit 
   board - Convection and Conduction. 
* Optional AirFlow - Extra Cooling for Extreme Overclocking
   The optional Airflow fan unit contains three 40mm tachometer-controlled 
   fans to provide impinging airflow to the memory subsystem. With the 
   moderate RPMs required to provide adequate forced air, the Airflow fan 
   is nearly silent. The fan easily clamps onto most motherboards. 
* Overclocking Now Made Easier with Enhanced Performance Profiles (EPP) 
   Corsair and NVIDIA have jointly developed a new open standard that 
   enhances the Serial Presence Detect (SPD). This exciting new development 
   simplifies the overclocking process while ensuring platform and 
   component compatibility. EPP compatible motherboards can access and take 
   advantage of added performance capabilities and information. The result: 
   simplified overclocking and unparalleled control for experts. 
www.corsair.com