Product Description:
The TS32MSD64V3F5 is a 32M x 64bits Double Data Rate SDRAM high-density
for DDR333.The TS32MSD64V3F5 consists of 8pcs CMOS 32Mx8 bits Double
Data Rate SDRAMs in 66 pin TSOP-II 400mil packages, and a 2048 bits
serial EEPROM on a 200-pin printed circuit board. The TS32MSD64V3F5 is
a Dual In-Line Memory Module and is intended for mounting into 200-pin
edge connector sockets.
Synchronous design allows precise cycle control with the use of system
clock. Data I/O transactions are possible on both edges of DQS. Range
of operation frequencies, programmable latencies allow the same device
to be useful for a variety of high bandwidth, high performance memory
system applications.
- RoHS compliant products.
- Power supply: VDD: 2.5V ± 0.2V, VDDQ: 2.5V ± 0.2V
- Max clock Freq: 166MHZ.
- Double-data-rate architecture; two data transfers per clock
cycle
- Differential clock inputs (CK and /CK)
- DLL aligns DQ and DQS transition with CK transition
- Auto and Self Refresh 7.8us refresh interval.
- Data I/O transactions on both edge of data strobe.
- Edge aligned data output, center aligned data input.
- Serial Presence Detect (SPD) with serial EEPROM
- SSTL-2 compatible inputs and outputs.
- MRS cycle with address key programs.
CAS Latency (Access from
column address) : 2.5
Burst Length (2, 4, 8)
Data Sequence (Sequential
& Interleave)
| Technology |
DDR RAM |
| Capacity |
256 MB |
| Bus
Clock |
333 MHz |
| Form
Factor |
SO DIMM 200-pin |
| Warranty |
Lifetime |
|
In Stock
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